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Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

★Trend of Transparent Resin: Resin with Fluorescent Materials! Low Stress Resinization! High Refractive Index!

**Lecture Summary** Semiconductor packaging technology is an important technology that enhances the functionality of electronic devices, alongside semiconductor miniaturization technology and logic design technology. It continues to lead the world in semiconductor packaging materials and assembly equipment. In recent years, the technology has evolved from SiP (System in Package) using multi-layer stacking of elements to MiP (Multi functions in a Package), which integrates not only electronic conduction but also wireless (RF) and optical (photon) functions within a single package. As LED assembly technology becomes a crucial technology for the MiP era, this presentation will provide an overview of the current LED assembly technology and discuss future development directions and impacts on the market.

  • Technical Seminar
  • LED Module
  • LED lighting

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Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

★New manufacturing methods (tandemization of multiple wavelengths, MCM, organic LEDs) ★Topics on phosphors (such as sialon phosphors) and key points of phosphor coating technology.

Speaker Mr. Gen Murakami, Ph.D. in Engineering, Representative Director of Genten Co., Ltd. Target Audience: Engineers, researchers, and relevant departments facing challenges with LED packages Venue: Tekno Kawasaki, 5th Floor, Room 5 [Kanagawa, Kawasaki] 10-minute walk from JR Nambu Line "Musashi-Mizonokuchi" Station Date and Time: March 29, 2011 (Tuesday) 12:30-16:30 Capacity: 30 people *Registration will close once full. Please apply early.

  • 企業：AndTech
  • 価格：10,000 yen-100,000 yen
  • Technical Seminar

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Design, structure, assembly technology of LED packages, and implementation technology on substrates.

Design, structure, assembly technology of LED packages, and implementation technology on substrates.

Trends in transparent resin: resin with phosphors! Low-stress resin! High refractive index! New manufacturing methods (multi-wavelength tandem, MCM, organic LED).

Speaker: Mr. Gen Murakami, President of Mototen Co., Ltd., Doctor of Engineering Venue: Tekno Kawasaki, 5th Floor, Room 5 Date and Time: March 29, 2011 (Tuesday) 12:30-16:30

  • 企業：AndTech
  • 価格：10,000 yen-100,000 yen
  • Technical Seminar

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Implementation and packaging technology of MEMS devices and improvement of reliability.

Implementation and packaging technology of MEMS devices and improvement of reliability.

★How to enhance reliability in terms of joint distortion and joint strength!? ★Increase reliability through semiconductor integration!

Speaker Part 1: Toshiba Corporation, Research and Development Center, Advanced BEOL Technology Development Department, Responsible Person Part 2: Misuzu Industries Co., Ltd., Responsible Person Part 3: Koga Research Institute Sensor Consultant / Part-time Lecturer at Ibaraki University / Industry-Academia-Government Collaboration Coordinator, Ph.D. Tomo Shimada Target Audience: Engineers and researchers related to MEMS devices and microfabrication processes Venue: Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 1 [Tokyo, Nihonbashi] Access: 4 minutes from Exit B3 of Higashi-Nihonbashi Station on the JR Toei Asakusa Line, towards Asakusabashi/ Oshiage Date and Time: December 22, 2011 (Thursday) 11:00 AM - 4:00 PM Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 51,450 yen (including tax and text fee) for 2 people from one company *Limited to Tech-Zone members who apply by December 8. Membership registration is free. *After December 8, the [Regular Price] will be 54,600 yen (including tax and text fee) for 2 people from one company.

  • 企業：AndTech
  • 価格：10,000 yen-100,000 yen
  • Technical Seminar

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Materials and mounting technologies for increasing the large current capacity, heat resistance, and heat dissipation of power devices.

Materials and mounting technologies for increasing the large current capacity, heat resistance, and heat dissipation of power devices.

The heat dissipation and heat resistance of components required due to the increase in large currents!

- Sealing, Bonding, Mounting Technology, Reliability Evaluation - High-Power Devices: the Advanced Materials and the Mounting Technology ★ The heat dissipation and heat resistance required for components due to increased current! ★ The demand for inverters is rising with the energy-saving of devices and the spread of EVs and HEVs. What are the future technological trends of power devices, which are the core technology!? 【Venue】 Kawasaki City International Exchange Center, Conference Room 1【Kanagawa, Kawasaki】 12 minutes on foot from Motosumiyoshi Station on the Tokyu Toyoko Line Date and Time June 27, 2013 (Thursday) 10:15-16:30

  • 企業：AndTech
  • 価格：10,000 yen-100,000 yen
  • Technical Seminar

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